Vn-Z.vn November 21, 2023, Today in Beijing, MediaTek officially launched the new Dimensity 8300 mobile chip, MediaTek Dimensity 8300 is positioned for the high-end mid-range smartphone market. As a new member of the Dimensity 8000 family, the Dimensity 8300 integrates advanced artificial intelligence technology and high performance with excellent gaming performance and fast and stable network connectivity.
The Dimensity 8300 uses the second generation 4nm manufacturing technology from TSMC, based on the Armv9 CPU architecture, with four Cortex-A715 performance CPU cores with a base frequency of up to 3.35GHz and four Cortex-efficient performance cores. A510 has a base frequency of up to 2.2GHz. Peak CPU performance has increased by 20% compared to the previous generation, while saving up to 30% of power.
Dimensity 8300 is also equipped with Mali-G615 6-core GPU, the GPU's peak performance increases by 60% compared to the previous generation and saves power consumption by 55%. Dimensity 8300 supports excellent memory and flash memory specifications, giving users a smooth and fluid experience in gaming, daily applications, photos and other situations.
MediaTek Dimensity 8300 is the first product in its class to support general artificial intelligence, supporting up to 100 billion parameters for the largest AI language model. This processor integrates MediaTek's APU 780 artificial intelligence processor, comes with a general artificial intelligence engine, integer and real number operator performance is doubled compared to the previous generation, supporting increased Transformer operator speed and INT4 quantification technology combined, the overall AI performance increased by 3.3 times compared to the previous generation, more powerful in running synthetic AI creative applications at the terminal.
Dimensity 8300 is equipped with MediaTek's new generation "Star Speed Engine", through unique performance algorithm, it can perform real-time resource scheduling based on application performance requirements. application and device temperature information, allowing users to enjoy high frame stability, low power consumption, and long battery life. Starspeed Engine not only cooperates widely with game applications, but also expands ecological cooperation with more types of applications and upgrades users' Application experience.
Dimensity 8300 also supports industry-leading LPDDR5X 8533Mbps memory, UFS 4.0 flash memory and Multi-Circular Queue (MCQ) technology. Memory transfer speed increased by 33% compared to the previous generation, and flash memory read and write speed increased by 100%.
The Dimensity 8300 is equipped with a 14-bit HDR-ISP Imagiq 980 image processor, which improves the terminal's computational imaging performance and upgrades the photo and video recording experience. Not only can users easily capture clearer, sharper 4K60 HDR video, but they can also enjoy longer battery life.
MediaTek Dimensity 8300 integrates a 3GPP R16 5G modem to deliver a faster and more stable 5G network experience. Dimensity 8300 is optimized for specific scenarios to achieve smoother 5G connections in weak signal network environments, while enhancing the connection performance and range of Sub-6GHz networks, supporting aggregation 3 carriers and the theoretical maximum downlink speed can reach 5.17Gbps.
Dimensity 8300 also supports MediaTek's 5G UltraSave 3.0+ power saving technology, which can reduce 5G communication power consumption by up to 20% and ensure long 5G battery life. Wi-Fi 6E has enhanced performance and supports 160 MHz bandwidth. Supporting Bluetooth Wi-Fi hyper-connectivity technology, the smartphone can simultaneously connect to Bluetooth headsets, wireless controllers and other peripherals with lower latency.
Lu Weibing, president of Xiaomi Group and general manager of Redmi brand, also attended the Dimensity 8300 launch conference and announced the leading AI platform Dimensity 8300-Ultra jointly developed by Redmi and MediaTek. The world's first Dimensity 8300-Ultra Redmi K70e phone, including the entire Redmi K70 mobile phone series, will be officially released this month.
The Dimensity 8300 uses the second generation 4nm manufacturing technology from TSMC, based on the Armv9 CPU architecture, with four Cortex-A715 performance CPU cores with a base frequency of up to 3.35GHz and four Cortex-efficient performance cores. A510 has a base frequency of up to 2.2GHz. Peak CPU performance has increased by 20% compared to the previous generation, while saving up to 30% of power.
Dimensity 8300 is also equipped with Mali-G615 6-core GPU, the GPU's peak performance increases by 60% compared to the previous generation and saves power consumption by 55%. Dimensity 8300 supports excellent memory and flash memory specifications, giving users a smooth and fluid experience in gaming, daily applications, photos and other situations.
MediaTek Dimensity 8300 is the first product in its class to support general artificial intelligence, supporting up to 100 billion parameters for the largest AI language model. This processor integrates MediaTek's APU 780 artificial intelligence processor, comes with a general artificial intelligence engine, integer and real number operator performance is doubled compared to the previous generation, supporting increased Transformer operator speed and INT4 quantification technology combined, the overall AI performance increased by 3.3 times compared to the previous generation, more powerful in running synthetic AI creative applications at the terminal.
Dimensity 8300 is equipped with MediaTek's new generation "Star Speed Engine", through unique performance algorithm, it can perform real-time resource scheduling based on application performance requirements. application and device temperature information, allowing users to enjoy high frame stability, low power consumption, and long battery life. Starspeed Engine not only cooperates widely with game applications, but also expands ecological cooperation with more types of applications and upgrades users' Application experience.
Dimensity 8300 also supports industry-leading LPDDR5X 8533Mbps memory, UFS 4.0 flash memory and Multi-Circular Queue (MCQ) technology. Memory transfer speed increased by 33% compared to the previous generation, and flash memory read and write speed increased by 100%.
The Dimensity 8300 is equipped with a 14-bit HDR-ISP Imagiq 980 image processor, which improves the terminal's computational imaging performance and upgrades the photo and video recording experience. Not only can users easily capture clearer, sharper 4K60 HDR video, but they can also enjoy longer battery life.
MediaTek Dimensity 8300 integrates a 3GPP R16 5G modem to deliver a faster and more stable 5G network experience. Dimensity 8300 is optimized for specific scenarios to achieve smoother 5G connections in weak signal network environments, while enhancing the connection performance and range of Sub-6GHz networks, supporting aggregation 3 carriers and the theoretical maximum downlink speed can reach 5.17Gbps.
Dimensity 8300 also supports MediaTek's 5G UltraSave 3.0+ power saving technology, which can reduce 5G communication power consumption by up to 20% and ensure long 5G battery life. Wi-Fi 6E has enhanced performance and supports 160 MHz bandwidth. Supporting Bluetooth Wi-Fi hyper-connectivity technology, the smartphone can simultaneously connect to Bluetooth headsets, wireless controllers and other peripherals with lower latency.
Lu Weibing, president of Xiaomi Group and general manager of Redmi brand, also attended the Dimensity 8300 launch conference and announced the leading AI platform Dimensity 8300-Ultra jointly developed by Redmi and MediaTek. The world's first Dimensity 8300-Ultra Redmi K70e phone, including the entire Redmi K70 mobile phone series, will be officially released this month.